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| Galaxy S III |
Samsung Electronics is rumored to be making the design of the Samsung Galaxy S III with a very thin thickness, ahead of other phones. Even the latest smart phone from Samsung is going to beat the thickness of the iPhone 4S that was recently launched.
As reported to Venture Beat, this phone would have a thickness of 7 mm (less than 1 cm), 1.49 mm thinner than its predecessor, the Samsung Galaxy S II. In fact, these phones will surpass the iPhone 4S thickness of 9.3 mm thick still.
If true Samsung will make a phone with a thickness of 7 mm, the Samsung is only narrowly defeated by the newly launched Huawei Acend P1 S with a thickness of only 6.7 mm. Orvendor Huawei NEC is following in the footsteps that would make the phones with the same thickness, namely N-05D ES Medias.
To achieve the level of thickness, the Samsung should use a component of about 10-20percent thinner than the usual components used in mobile phones before. Especially in the Printed Circuit Board (PCB), the connector and the processor chip. This was to fulfill the ambitions of Samsung phones that will be buried with his first quad core processor.
Additionally, this phone will be supplied with a rear camera and front camera 8MPresolution of 2MP. Not to mention Samsung will include network support Long Term Evolution (LTE) or 4G.
Samsung Galaxy S III is also rumored to be launched in May 2012. Rumors, Samsung will provide an opportunity for Samsung Galaxy S II in order to sell more.
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| Galaxy S III |
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| Galaxy S III |
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